Comments on: Completed The Higher Advanced Electronics Repair Course

By: Jestine Yong

Jestine Yong — Fri, 05 Jul 2019 01:34:03 +0000

In reply to Adeleke Abel.

Hi Adeleke,

Thanks.

Jestine

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By: Adeleke Abel

Adeleke Abel — Thu, 04 Jul 2019 20:39:44 +0000

Congratulations

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By: Jestine Yong

Jestine Yong — Thu, 04 Jul 2019 08:37:34 +0000

In reply to Yogesh Panchal.

Hi Yogesh,

Thanks.

Jestine

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By: Yogesh Panchal

Yogesh Panchal — Thu, 04 Jul 2019 08:17:05 +0000

Congratulations! Everybody.

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By: Jestine Yong

Jestine Yong — Mon, 01 Jul 2019 14:25:27 +0000

In reply to albert van bemmelen.

Hi Albert,

We did not use the pre-heater on the BGA reballing unless if the IC really hard to be removed. It was the hot air blown from the bottom to the top to remove those components that was soldered to a double sided track.

Jestine

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By: Jestine Yong

Jestine Yong — Mon, 01 Jul 2019 14:19:52 +0000

In reply to Justice.

Hi Justice,

Thanks.

Jestine

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By: albert van bemmelen

albert van bemmelen — Mon, 01 Jul 2019 13:34:05 +0000

I see reballing bga chips was part of the advanced training. I guess they also used some kind of small pre-heater on their desks? (I am curious what small device they exactly used). Congratulations to all participants!

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By: Justice

Justice — Mon, 01 Jul 2019 12:58:18 +0000

Interesting to see happy faces I wish I was part of the team too.

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By: Jestine Yong

Jestine Yong — Mon, 01 Jul 2019 02:41:51 +0000

In reply to Parasuraman S.

Hi Parasuraman,

Thanks.

Jestine

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By: Parasuraman S

Parasuraman S — Mon, 01 Jul 2019 02:10:15 +0000

Well done! Congratulations!

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